Thermal One-Part Hybrids
HT4500
Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Overview
One-Part Dispensable Very Low Compression ForceThermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.
Typical Applications
Typical Applications
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
- Power supplies & semiconductors
- Memory & power modules
- Power electronics Features
- High thermal performance and low contact resistance
- Easily dispensable and reworkable
- High compressibility for low stress applications Long-term reliability
- No pump-out or cracking risk
- Reduced oil separation
- Requires no mixing, additional curing or low temperature storage
Specifications
Others
- Color
- Green
- Thermal Conductivity
- 4.5 W/m-K, Test Method, ASTM D5470
- Storage temperature
- RT
- Dielectric Strength
- 5 KV/mm, Test Method D149
- Volume Resistivity
- >1.0X1013 ohm-cm, Test Method ASTM D257
- Specific Gravity
- 3.3, Test Method ASTM D792
- Cure Schedule
- Pre-cured
- Typical Uses
- Automotive electronics
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Key Features
- Easily dispensable and reworkable
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- Long-term reliability
- No pump-out or cracking risk
- Printable
- Reduced oil separation
- Application
- Automation Gap Filler
- Shelf Life
- 6 months
Others
- Color
- Green
- Thermal Conductivity
- 4.5 W/m-K, Test Method, ASTM D5470
- Storage temperature
- RT
- Dielectric Strength
- 5 KV/mm, Test Method D149
- Volume Resistivity
- >1.0X1013 ohm-cm, Test Method ASTM D257
- Specific Gravity
- 3.3, Test Method ASTM D792
- Cure Schedule
- Pre-cured
- Typical Uses
- Automotive electronics
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Key Features
- Easily dispensable and reworkable
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- Long-term reliability
- No pump-out or cracking risk
- Printable
- Reduced oil separation
- Application
- Automation Gap Filler
- Shelf Life
- 6 months
- Color : Green
- Thermal Conductivity : 4.5 W/m-K, Test Method, ASTM D5470
- Storage temperature : RT
- Dielectric Strength : 5 KV/mm, Test Method D149
- Volume Resistivity : >1.0X1013 ohm-cm, Test Method ASTM D257
- Specific Gravity : 3.3, Test Method ASTM D792
- Cure Schedule : Pre-cured
- Typical Uses : Automotive electronics|Consumer electronics|Memory & power modules|Power electronics|Power supplies|Telecommunications equipment
- Key Features : Easily dispensable and reworkable|High compressibility for low stress applications|High thermal performance and low contact resistance|Long-term reliability|No pump-out or cracking risk|Printable|Reduced oil separation
- Application : Automation Gap Filler
- Shelf Life : 6 months
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Data Sheet
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.4 KB
12/19/2022
42.4 KB
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.4 KB
12/19/2022
42.4 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
HT4500 - Thermally Conductive Gap Filler
42.4 KB
12/19/2022
