Phase Change Materials
PCM45F Series
Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications with providing a thin bond line and high reliability without pump-out issues. (2.0-2.5 W/m-K)
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Overview
Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bond line and high reliability without pump-out issues.Typical Applications• Power control unit, inverter, onboard electronics• IGBT• Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)• Switches, routers, base stations• Tablets, gaming, notebooks, smartphones, action cameras• LightingFeatures• High performance filler and polymer technology• Phase change at 45 ˚C• Highly conductive filler loading to optimize performance• Superior handling and rework ability• Superior reliable thermal performance• Range of thermal properties to fit different needs
Specifications
Others
- Shelf Life
- 12 months
- Thermal Conductivity
- 2.0-2.5 W/m-K, Test Method ASTM D5470
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
- Thermal Impedance
- 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Specific Gravity
- 2.2, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Key Features
- High Reliability
- Application
- High Reliability
Others
- Shelf Life
- 12 months
- Thermal Conductivity
- 2.0-2.5 W/m-K, Test Method ASTM D5470
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
- Thermal Impedance
- 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Specific Gravity
- 2.2, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Key Features
- High Reliability
- Application
- High Reliability
- Shelf Life : 12 months
- Thermal Conductivity : 2.0-2.5 W/m-K, Test Method ASTM D5470
- Volume Resistivity : 8.2x1014 ohm-cm, Test Method ASTM D258
- Thermal Impedance : 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Specific Gravity : 2.2, Test Method ASTM D374
- Thickness (mm) : 0.20-1.00
- Typical Uses : IGBT|Lighting|Power control unit, inverter, onboard electronics|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras
- Key Features : High Reliability
- Application : High Reliability
Others
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 79.35 KB
11/8/2022
79.35 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 79.35 KB
11/8/2022
79.35 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
79.35 KB
11/8/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
