Thermal Putty Pads
TGP8000PT
Honeywell Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (8.0 W/m�K, ultra soft pad)
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Overview
Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material�s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.Typical Applications� EV battery & charging station� Automotive electronics� Power devices & modules� Telecommunications & network serversFeatures� High thermal performance� Ultra-soft� High compressibility� Excellent gap-filling capability� Naturally tacky
Specifications
Others
- Dielectric Constant
- 8.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10<sup>15</sup> ohm-cm, Test Method ASTM D257
- Flammability
- V-0, Test Method UL94
- Application
- Automotive electronics
- EV battery & charging station
- EV battery & charging station
- Power devices & modules
- Power devices & modules
- Telecommunications & network servers
- Telecommunications & network servers
- Key Features
- Extra Soft
- Typical Uses
- Automotive electronics
- EV battery & charging station
- EV battery & charging station
- Power devices & modules
- Power devices & modules
- Telecommunications & network servers
- Telecommunications & network servers
- Color
- Grey
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Specific Gravity
- 3.5, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.19 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Others
- Dielectric Constant
- 8.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10<sup>15</sup> ohm-cm, Test Method ASTM D257
- Flammability
- V-0, Test Method UL94
- Application
- Automotive electronics
- EV battery & charging station
- EV battery & charging station
- Power devices & modules
- Power devices & modules
- Telecommunications & network servers
- Telecommunications & network servers
- Key Features
- Extra Soft
- Typical Uses
- Automotive electronics
- EV battery & charging station
- EV battery & charging station
- Power devices & modules
- Power devices & modules
- Telecommunications & network servers
- Telecommunications & network servers
- Color
- Grey
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Specific Gravity
- 3.5, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.19 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Thermal Impedance : 0.19 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Thermal Conductivity : 8.0 W/m-K, Test Method ASTM D5470
- Specific Gravity : 3.5, Test Method ASTM D792
- Hardness : 5 Shore00, Test Method ASTM D2240
- Color : Grey
- Volume Resistivity : 4.0x1015 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Dielectric Constant : 8.5 at 1MHz, Test Method ASTM D150
- Application : Automotive electronics|EV battery & charging station|EV battery & charging station|Power devices & modules|Power devices & modules|Telecommunications & network servers|Telecommunications & network servers
- Typical Uses : Automotive electronics|EV battery & charging station|EV battery & charging station|Power devices & modules|Power devices & modules|Telecommunications & network servers|Telecommunications & network servers
- Key Features : Extra Soft
Others
Name
Description
File Size
Date
Size
Thermal Putty Pads: TGP3500PT - 8000PT
application/pdf 113.1 KB
10/31/2023
113.1 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Thermal Putty Pads: TGP3500PT - 8000PT
application/pdf 113.1 KB
10/31/2023
113.1 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
