Thermal Putty Pads
TGP3510PT
Honeywell Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (8.0 W/m·K, ultra soft pad)
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Overview
Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.Typical Applications• EV battery & charging station• Automotive electronics• Power devices & modules• Telecommunications & network serversFeatures• High thermal performance• Ultra-soft• High compressibility• Excellent gap-filling capability• Naturally tacky
Data Sheet
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Description
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Date
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Technical Data Sheet
application/pdf 45.46 KB
11/8/2022
45.46 KB
Name
Description
File Size
Date
Size
Technical Data Sheet
application/pdf 45.46 KB
11/8/2022
45.46 KB
Name
Description
File Size
Date
Size
