Thermal One-Part Hybrids
HT4500
Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability � they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.
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Overview
One-Part Dispensable Very Low Compression ForceThermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability � they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.
Typical Applications
Typical Applications
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
- Power supplies & semiconductors
- Memory & power modules
- Power electronics Features
- High thermal performance and low contact resistance
- Easily dispensable and reworkable
- High compressibility for low stress applications Long-term reliability
- No pump-out or cracking risk
- Reduced oil separation
- Requires no mixing, additional curing or low temperature storage
Specifications
Others
- Volume Resistivity
- >1.0X1013 ohm-cm, Test Method ASTM D257
- Application
- Automation Gap Filler
- Key Features
- Easily dispensable and reworkable
- High compressibility for low stress applications
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- High thermal performance and low contact resistance
- Long-term reliability
- Long-term reliability
- No pump-out or cracking risk
- No pump-out or cracking risk
- Reduced oil separation
- Reduced oil separation
- Typical Uses
- Automotive electronics
- Consumer electronics
- Consumer electronics
- Memory & power modules
- Memory & power modules
- Power electronics
- Power electronics
- Power supplies
- Power supplies
- Telecommunications equipment
- Telecommunications equipment
- Color
- Green
- Cure Schedule
- Pre-cured
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.3, Test Method ASTM D792
- Storage Temperature
- RT
- Thermal Conductivity
- 4.5 W/m-K, Test Method, ASTM D5470
- Dielectric Strength
- 5 KV/mm, Test Method D149
Others
- Volume Resistivity
- >1.0X1013 ohm-cm, Test Method ASTM D257
- Application
- Automation Gap Filler
- Key Features
- Easily dispensable and reworkable
- High compressibility for low stress applications
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- High thermal performance and low contact resistance
- Long-term reliability
- Long-term reliability
- No pump-out or cracking risk
- No pump-out or cracking risk
- Reduced oil separation
- Reduced oil separation
- Typical Uses
- Automotive electronics
- Consumer electronics
- Consumer electronics
- Memory & power modules
- Memory & power modules
- Power electronics
- Power electronics
- Power supplies
- Power supplies
- Telecommunications equipment
- Telecommunications equipment
- Color
- Green
- Cure Schedule
- Pre-cured
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.3, Test Method ASTM D792
- Storage Temperature
- RT
- Thermal Conductivity
- 4.5 W/m-K, Test Method, ASTM D5470
- Dielectric Strength
- 5 KV/mm, Test Method D149
- Thermal Conductivity : 4.5 W/m-K, Test Method, ASTM D5470
- Specific Gravity : 3.3, Test Method ASTM D792
- Shelf Life : 6 months Year
- Cure Schedule : Pre-cured
- Color : Green
- Volume Resistivity : >1.0X1013 ohm-cm, Test Method ASTM D257
- Dielectric Strength : 5 KV/mm, Test Method D149
- Storage Temperature : RT
- Application : Automation Gap Filler
- Typical Uses : Automotive electronics|Consumer electronics|Consumer electronics|Memory & power modules|Memory & power modules|Power electronics|Power electronics|Power supplies|Power supplies|Telecommunications equipment|Telecommunications equipment
- Key Features : Easily dispensable and reworkable|High compressibility for low stress applications|High compressibility for low stress applications|High thermal performance and low contact resistance|High thermal performance and low contact resistance|Long-term reliability|Long-term reliability|No pump-out or cracking risk|No pump-out or cracking risk|Reduced oil separation|Reduced oil separation
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Data Sheet
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.75 KB
10/31/2023
42.75 KB
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.75 KB
10/31/2023
42.75 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
HT4500 - Thermally Conductive Gap Filler
42.75 KB
10/31/2023
