Thermal One-Part Hybrids
HT10000
Honeywell HT series products are precured one component, made of cross-linked silicone w/ceramic particles, dispensable and reworkable, high compressibility for low stress applications, no mixing, and additional curing or low temp storage(10.0 W/m�K)
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Overview
One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability � they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.Typical Applications� Consumer electronics� Telecommunications equipment� Automotive electronics� Power supplies & semiconductors� Memory & power modules� Power electronicsFeatures� High thermal performance and low contact resistance� Easily dispensable and reworkable� High compressibility for low stress applications� Long-term reliability� No pump-out or cracking risk� Reduced oil separation� Requires no mixing, additional curing or low temperature storage
Specifications
Others
- Application
- Automation Gap Filler
- Key Features
- Easily dispensable and reworkable
- High compressibility for low stress applications
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- High thermal performance and low contact resistance
- Long-term reliability
- Long-term reliability
- Low oil bleeding
- Low oil bleeding
- No pump-out or cracking risk
- No pump-out or cracking risk
- Pre-cure
- Pre-cure
- Typical Uses
- Automotive electronics
- Consumer electronics
- Consumer electronics
- Memory & power modules
- Memory & power modules
- Power electronics
- Power electronics
- Power supplies
- Power supplies
- Telecommunications equipment
- Telecommunications equipment
- Color
- N/A
- Dispense Rate
- N/A
- Outgassing
- N/A
- Shelf Life
- 6 months Year
- Specific Gravity
- N/A
- Storage Temperature
- N/A
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- N/A
Others
- Application
- Automation Gap Filler
- Key Features
- Easily dispensable and reworkable
- High compressibility for low stress applications
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- High thermal performance and low contact resistance
- Long-term reliability
- Long-term reliability
- Low oil bleeding
- Low oil bleeding
- No pump-out or cracking risk
- No pump-out or cracking risk
- Pre-cure
- Pre-cure
- Typical Uses
- Automotive electronics
- Consumer electronics
- Consumer electronics
- Memory & power modules
- Memory & power modules
- Power electronics
- Power electronics
- Power supplies
- Power supplies
- Telecommunications equipment
- Telecommunications equipment
- Color
- N/A
- Dispense Rate
- N/A
- Outgassing
- N/A
- Shelf Life
- 6 months Year
- Specific Gravity
- N/A
- Storage Temperature
- N/A
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- N/A
- Thermal Impedance : N/A
- Thermal Conductivity : 10.0 W/m-K, Test Method ASTM D5470
- Specific Gravity : N/A
- Shelf Life : 6 months Year
- Outgassing : N/A
- Dispense Rate : N/A
- Color : N/A
- Storage Temperature : N/A
- Application : Automation Gap Filler
- Typical Uses : Automotive electronics|Consumer electronics|Consumer electronics|Memory & power modules|Memory & power modules|Power electronics|Power electronics|Power supplies|Power supplies|Telecommunications equipment|Telecommunications equipment
- Key Features : Easily dispensable and reworkable|High compressibility for low stress applications|High compressibility for low stress applications|High thermal performance and low contact resistance|High thermal performance and low contact resistance|Long-term reliability|Long-term reliability|Low oil bleeding|Low oil bleeding|No pump-out or cracking risk|No pump-out or cracking risk|Pre-cure|Pre-cure
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
