Phase Change Materials
PTM5000
PTM5000 is a Phase Change Pad with a Thermal Impedance of 0.06 – 0.08 (°C cm²/w), Thermal Conductivity of 4.4 (w/mk) and Specific Gravity of 2.3 (g/cm³).
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Overview
PTM5000 is Honeywell's thermally conductive phase change material in pad form. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications.PTM5000 has a Thermal conductivity of 3.5 - 4.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices. Clamping pressure and temperature are suggested to achieve a minimum bondline thickness for the best performance. All information for thermal impedance is collected after the product is fully phase-changed without a shim.
Specifications
Others
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
- Application
- High Reliability
- Key Features
- High Reliability
- Typical Uses
- IGBT
- IGBT
- Lighting
- Lighting
- Power control unit, inverter, onboard electronics
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Tablets, gaming, notebooks, smartphones, action cameras
- Color
- Pink
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.3, Test Method ASTM D374
- Thickness (mm)
- 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Format
- Pad
Others
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
- Application
- High Reliability
- Key Features
- High Reliability
- Typical Uses
- IGBT
- IGBT
- Lighting
- Lighting
- Power control unit, inverter, onboard electronics
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Tablets, gaming, notebooks, smartphones, action cameras
- Color
- Pink
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.3, Test Method ASTM D374
- Thickness (mm)
- 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Format
- Pad
- Thickness (mm) : 0.2 / 0.25 / 0.3 / 0.4 / 0.5
- Thermal Impedance : 0.06-0.08 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity : 4.4 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.3, Test Method ASTM D374
- Shelf Life : 12 months Year
- Color : Pink
- Volume Resistivity : 2.1x1014 ohm-cm, Test Method ASTM D259
- Application : High Reliability
- Typical Uses : IGBT|IGBT|Lighting|Lighting|Power control unit, inverter, onboard electronics|Power control unit, inverter, onboard electronics|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras|Tablets, gaming, notebooks, smartphones, action cameras
- Key Features : High Reliability
- Format : Pad
Others
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 64.53 KB
10/31/2023
64.53 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 64.53 KB
10/31/2023
64.53 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
64.53 KB
10/31/2023
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
Product Number
Image
SKU
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103717
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103717
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PTM3180-SHT 100MMX200MMX0.43MM
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PTM3180-SHT 100MMX200MMX0.43MM
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PTM3180-CRF 50MMX50MMX0.43MM
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98644
PTM3180-SHT 70MMX370MMX0.25MM
98644
PTM3180-SHT 70MMX370MMX0.25MM
Image
SKU
Description
103717
PTM3180-CRF Demo2
103717
PTM3180-CRF Demo2
104715
PTM3180-CRF 43MMX43MMX0.25MM
104715
PTM3180-CRF 43MMX43MMX0.25MM
97677
PTM3180-CRF 40MMX45MMX0.25MM
97677
PTM3180-CRF 40MMX45MMX0.25MM
98393
PTM3180-SHT 100MMX200MMX0.43MM
98393
PTM3180-SHT 100MMX200MMX0.43MM
98394
PTM3180-CRF 50MMX50MMX0.43MM
98394
PTM3180-CRF 50MMX50MMX0.43MM
98644
PTM3180-SHT 70MMX370MMX0.25MM
98644
PTM3180-SHT 70MMX370MMX0.25MM
