Silicon Etchants
Nitric Acid Etching Mixture (81104)
SEF 555-223-222, VLSI
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Overview
Specifications
Others
- CAS Number
- 7697-37-2
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
- Boiling Point/Range
- No data available
- Color
- Colorless
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Stinging
- Physical Form
- Liquid
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
Others
- CAS Number
- 7697-37-2
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
- Boiling Point/Range
- No data available
- Color
- Colorless
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Stinging
- Physical Form
- Liquid
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
- CAS Number : 7697-37-2
- Boiling Point/Range : No data available
- Physical Form : Liquid
- Odor : Stinging
- Melting Point/Range : No data available
- Flashpoint : Not applicable
- Color : Colorless
- Thermal Decomposition : To avoid thermal decomposition, do not overheat.
- Incompatible Materials : Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Ignition Temperature : Not applicable
- Corrosivity : Corrosive to metals
- UN Number : 2922
- Sub Class 1 : 6.1
- Packing Group : II
- Harmonized System Code : 38249996
- Chemical Class : 8
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
