Anodes
Solstice Plating Anodes, backed by our robust supply chain and metrology capabilities, provide consistency and reliability in performance.
Continued growth in flip chip packaging points toward the increased adoption of electroplating for wafer bumping applications. Solstice is uniquely positioned to provide Sn- and Cu-based Plating Anodes for use in wafer bumping.
Solstice R
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Solstice Advanced Materials Inc.
115 Tabor Rd.
Morris Plains, NJ 07950